SEMICONDUCTOR DEVICE, METHOD OF FORMING A PACKAGED CHIP DEVICE AND CHIP PACKAGE

SEMICONDUCTOR DEVICE, METHOD OF FORMING A PACKAGED CHIP DEVICE AND CHIP PACKAGE

According to one embodiment, the semiconductor device is of the multi-chip type. The semiconductor device has a embedded-chip-package-in-substrate, a wiring layer, and plural second chips. The embedded-chip-package-in-substrate has the first chip accommodated in it. The wiring layer is formed on the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: HOSOMI EIICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:According to one embodiment, the semiconductor device is of the multi-chip type. The semiconductor device has a embedded-chip-package-in-substrate, a wiring layer, and plural second chips. The embedded-chip-package-in-substrate has the first chip accommodated in it. The wiring layer is formed on the top surface of the embedded-chip-package-in-substrate. Plural second chips are stacked on the wiring layer.