SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

An electrode pad is provided above a circuit block of a semiconductor integrated circuit device. A junction point A and a junction point B are provided on connection lines connecting electrode pads to an internal circuit and an electrostatic discharge (ESD) protection circuit. The junction point A a...

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Bibliographische Detailangaben
Hauptverfasser:	SEGAWA HIROAKI, NARUSE TATSUYA, MATSUI TOORU, KUMASHIRO YOSHIFUMI, HIROFUJI MASANORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electrode pad is provided above a circuit block of a semiconductor integrated circuit device. A junction point A and a junction point B are provided on connection lines connecting electrode pads to an internal circuit and an electrostatic discharge (ESD) protection circuit. The junction point A and the junction point B are positioned at locations closer to the ESD protection circuit than to the electrode pads.