Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion

Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatmen...

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Bibliographische Detailangaben
Hauptverfasser: LOCKARD MICHAEL S, KUMAR ANANDA H, KRUGLICK EZEKIEL J.J, COHEN ADAM L, ZHANG GANG, KIM KIEUN
Format: Patent
Sprache:eng
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Zusammenfassung:Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.