3D ASSEMBLY FOR INTERPOSER BOW

A method for packaging a semiconductor device includes attaching a first array of solder material to a first surface of an interposer; bringing the first array of solder material into physical contact with a laminate; and initially bonding the interposer to the laminate by applying a first temperatu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAKUMA KATSUYUKI, INTERRANTE MARIO J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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