LAND GRID ARRAY (LGA) SOCKET CARTRIDGE AND METHOD OF FORMING

Aspects of the present invention relate to land grid array socket cartridge structures. In one embodiment, a land grid array (LGA) cartridge structure includes: a deformable thin film having at least one aperture configured to hold a substantially liquid metal, whereby in a compressed state of the deformable thin film, the substantially liquid metal of the deformable thin film is configured to electro-mechanically couple a carrier and a socket base. Another embodiment includes a method of forming a LGA cartridge structure. The method includes: providing a deformable thin film having a first surface and a second surface, and forming at least one aperture within the deformable thin film through the first surface and the second surface, wherein the aperture is configured to hold a substantially liquid metal.