METHOD FOR CONNECTING PLATES OF A SUBSTRATE DEVICE

An approach is provided for a method for connecting multiple plates of a substrate device, the substrate device at least comprises a conductive layer and a plate has at least one hollowed hole that is used to directly transfer the heat from a high power electrical chip to the conductive layer, the m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OU YANG CHIEH, OU YANG WEI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An approach is provided for a method for connecting multiple plates of a substrate device, the substrate device at least comprises a conductive layer and a plate has at least one hollowed hole that is used to directly transfer the heat from a high power electrical chip to the conductive layer, the method comprises acts of forming a first cupper layer on a top surface of the plate and forming a second cupper layer on a bottom surface of the plate, printing a circuit on the first cupper layer, and soldering the second cupper layer on the conductive layer with a soldering paste.