DIE PACKAGE STRUCTURE

DIE PACKAGE STRUCTURE

A die packaged structure is provided, which includes a die having the pad disposed on one side of the active surface. A packaged substrate having a front surface and a back surface, and the connecting terminal disposed on one side of the packaged substrate region, and passed through the packaged sub...

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1. Verfasser: CHEN SHIHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description A die packaged structure is provided, which includes a die having the pad disposed on one side of the active surface. A packaged substrate having a front surface and a back surface, and the connecting terminal disposed on one side of the packaged substrate region, and passed through the packaged substrate region. An opening is disposed between the connecting terminal and one side of the packaged substrate region. Then, the back surface of the packaged substrate is fixed on die by an adhesive layer, such that the pad is exposed on the opening of the packaged substrate region. A conductive wire is electrically connected the pad with the connecting terminal, and a packaged body is encapsulated the packaged substrate region, the die and the conductive wire, and the external connecting terminal is exposed on the packaged substrate region. A conductive component is arranged on the external connecting terminal.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014183714A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014183714A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014183714A13</originalsourceid><addsrcrecordid>eNrjZBB18XRVCHB09nZ0d1UIDgkKdQ4JDXLlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoYmhhbG5oYmjobGxKkCAAlhH70</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DIE PACKAGE STRUCTURE</title><source>esp@cenet</source><creator>CHEN SHIHI</creator><creatorcontrib>CHEN SHIHI</creatorcontrib><description>A die packaged structure is provided, which includes a die having the pad disposed on one side of the active surface. A packaged substrate having a front surface and a back surface, and the connecting terminal disposed on one side of the packaged substrate region, and passed through the packaged substrate region. An opening is disposed between the connecting terminal and one side of the packaged substrate region. Then, the back surface of the packaged substrate is fixed on die by an adhesive layer, such that the pad is exposed on the opening of the packaged substrate region. A conductive wire is electrically connected the pad with the connecting terminal, and a packaged body is encapsulated the packaged substrate region, the die and the conductive wire, and the external connecting terminal is exposed on the packaged substrate region. A conductive component is arranged on the external connecting terminal.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140703&amp;DB=EPODOC&amp;CC=US&amp;NR=2014183714A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140703&amp;DB=EPODOC&amp;CC=US&amp;NR=2014183714A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN SHIHI</creatorcontrib><title>DIE PACKAGE STRUCTURE</title><description>A die packaged structure is provided, which includes a die having the pad disposed on one side of the active surface. A packaged substrate having a front surface and a back surface, and the connecting terminal disposed on one side of the packaged substrate region, and passed through the packaged substrate region. An opening is disposed between the connecting terminal and one side of the packaged substrate region. Then, the back surface of the packaged substrate is fixed on die by an adhesive layer, such that the pad is exposed on the opening of the packaged substrate region. A conductive wire is electrically connected the pad with the connecting terminal, and a packaged body is encapsulated the packaged substrate region, the die and the conductive wire, and the external connecting terminal is exposed on the packaged substrate region. A conductive component is arranged on the external connecting terminal.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB18XRVCHB09nZ0d1UIDgkKdQ4JDXLlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoYmhhbG5oYmjobGxKkCAAlhH70</recordid><startdate>20140703</startdate><enddate>20140703</enddate><creator>CHEN SHIHI</creator><scope>EVB</scope></search><sort><creationdate>20140703</creationdate><title>DIE PACKAGE STRUCTURE</title><author>CHEN SHIHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014183714A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN SHIHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN SHIHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DIE PACKAGE STRUCTURE</title><date>2014-07-03</date><risdate>2014</risdate><abstract>A die packaged structure is provided, which includes a die having the pad disposed on one side of the active surface. A packaged substrate having a front surface and a back surface, and the connecting terminal disposed on one side of the packaged substrate region, and passed through the packaged substrate region. An opening is disposed between the connecting terminal and one side of the packaged substrate region. Then, the back surface of the packaged substrate is fixed on die by an adhesive layer, such that the pad is exposed on the opening of the packaged substrate region. A conductive wire is electrically connected the pad with the connecting terminal, and a packaged body is encapsulated the packaged substrate region, the die and the conductive wire, and the external connecting terminal is exposed on the packaged substrate region. A conductive component is arranged on the external connecting terminal.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title DIE PACKAGE STRUCTURE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T21%3A28%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHEN%20SHIHI&rft.date=2014-07-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014183714A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true