DIE PACKAGE STRUCTURE

A die packaged structure is provided, which includes a die having the pad disposed on one side of the active surface. A packaged substrate having a front surface and a back surface, and the connecting terminal disposed on one side of the packaged substrate region, and passed through the packaged substrate region. An opening is disposed between the connecting terminal and one side of the packaged substrate region. Then, the back surface of the packaged substrate is fixed on die by an adhesive layer, such that the pad is exposed on the opening of the packaged substrate region. A conductive wire is electrically connected the pad with the connecting terminal, and a packaged body is encapsulated the packaged substrate region, the die and the conductive wire, and the external connecting terminal is exposed on the packaged substrate region. A conductive component is arranged on the external connecting terminal.