BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS

An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TSANG KWOK CHEUNG, MCLELLAN NEIL, SZE MING WANG, LAM WING KEUNG, TAM WAI KIT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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