BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS

An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.