INTEGRATED CIRCUIT AND METHOD FOR FABRICATING AN INTEGRATED CIRCUIT EQUIPPED WITH A TEMPERATURE PROBE

This integrated circuit comprises: a substrate, a first electrical conductor comprising a first end, the first electrical conductor being electrically insulated from the substrate, a second electrical conductor comprising a second end, the second electrical conductor being electrically insulated from the substrate and electrically insulated from the first electrical conductor except at the second end which is mechanically and electrically directly in contact with the first end to form an electrical junction. The first and second ends are entirely buried to at least 5 μm depth inside the substrate and produced, respectively, in different first and second materials chosen for the absolute value of the Seebeck coefficient of the junction to be greater than 1 μV/K at 20° C. such that the combination of these first and second conductors forms a temperature probe.