RESIN FOAM AND PROCESS FOR PRODUCING THE SAME

RESIN FOAM AND PROCESS FOR PRODUCING THE SAME

A resin foam has a thickness recovery rate (23° C., one minute, 50% compression) of 70% or more and a strain recovery rate (80° C., 24 hours, 50% compression) of 80% or more. The thickness recovery rate is determined by compressing the resin foam, holding the resin foam in the compressed state, deco...

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Bibliographische Detailangaben
Hauptverfasser: KANADA MITSUHIRO, OTA MIE, KANDORI YUKO, KOUNO YOSHINORI, YASUDA HIRONORI
Format: Patent
Sprache:eng
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:A resin foam has a thickness recovery rate (23° C., one minute, 50% compression) of 70% or more and a strain recovery rate (80° C., 24 hours, 50% compression) of 80% or more. The thickness recovery rate is determined by compressing the resin foam, holding the resin foam in the compressed state, decompressing the resin foam, measuring a thickness of the resin foam one second after the decompression, and calculating a percentage of the measured thickness with respect to the initial thickness as the thickness recovery rate. The strain recovery rate is determined by compressing the resin foam, holding the resin foam in the compressed state, returning the resin foam to 23° C. while maintaining the compressed state, decompressing the resin foam, and determining a percentage of a recovered distance with respect to a compressed distance as the strain recovery rate.