Ceramic Filled Fluoropolymer Compositions, Methods and Applications Thereof

The present disclosure is in the field of electrical circuits and particularly to circuits characterized by plural conductive paths supported on a non-conductive substrate. The disclosure relates to ceramic filler compositions and methods for preparing said compositions. Further, the present disclosure discloses fluoropolymer-ceramic filler compositions and their laminates along with their respective methods for preparing the same. Said fluoropolymer-ceramic filler compositions provide for excellent properties for dielectric constant, loss tangent and temperature coefficient of dielectric constant. In addition, electrical substrate materials comprising of a conductive outer layer supported on a thin sheet of insulating material is also disclosed.