PROCESS FOR POLISHING A SEMICONDUCTOR WAFER, COMPRISING THE SIMULTANEOUS POLISHING OF A FRONT SIDE AND OF A REVERSE SIDE OF A SUBSTRATE WAFER

PROCESS FOR POLISHING A SEMICONDUCTOR WAFER, COMPRISING THE SIMULTANEOUS POLISHING OF A FRONT SIDE AND OF A REVERSE SIDE OF A SUBSTRATE WAFER

A process for polishing a semiconductor wafer includes simultaneous polishing of a front side and of a reverse side of a substrate wafer in the presence of polishing medium so as to achieve material removal from the front side and the reverse side of the substrate wafer. The simultaneous polishing i...

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Bibliographische Detailangaben
Hauptverfasser: HEILMAIER ALEXANDER, MISTUR LESZEK, ROETTGER KLAUS, TABATA MAKOTO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A process for polishing a semiconductor wafer includes simultaneous polishing of a front side and of a reverse side of a substrate wafer in the presence of polishing medium so as to achieve material removal from the front side and the reverse side of the substrate wafer. The simultaneous polishing includes a first step and a second step. A speed of material removal in the first step is higher than in the second step. The first step includes the use of a first polishing slurry as a polishing medium and the second step includes a second polishing slurry as the polishing medium. The second polishing slurry differs from the first polishing slurry at least in that the second polishing slurry comprises a polymeric additive.