HEAT SINK FOR LIGHT EMITTING DIODE

A heat sink includes a base, to which an LED element is attached, and a plate-shaped heat dissipating surface integrally and continuously formed with the base around the LED element. The base and the plate-shaped heat dissipating surface are formed of aluminum or an aluminum alloy having a specific...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MATSUDA HARUYUKI, KONISHI HARUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	A heat sink includes a base, to which an LED element is attached, and a plate-shaped heat dissipating surface integrally and continuously formed with the base around the LED element. The base and the plate-shaped heat dissipating surface are formed of aluminum or an aluminum alloy having a specific thermal conductivity λ and a specific surface emissivity . When the plate thickness of the base and the plate-shaped heat dissipating surface is specified in a range from 0.8 to 6 mm, a total projected area of the heat dissipating surfaces of the heat sink is specified in a range from 19000 to 60000 mm2 so as to obtain a heat resistance of 4.0 K/W or smaller. Projected areas of two plate-shaped heat dissipating surfaces of the heat sink in two different directions are sufficiently increased with respect to corresponding sectional areas of the base.