SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the o...

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Hauptverfasser: BYUN JAEBUM, OH JOONYOUNG, JEONG JAE-WOO, CHOI JINYOUNG, KANG HEEYOUB, LEE WON-HWA, KWAK DONGOK, KIM JUNGHOON
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator BYUN JAEBUM
OH JOONYOUNG
JEONG JAE-WOO
CHOI JINYOUNG
KANG HEEYOUB
LEE WON-HWA
KWAK DONGOK
KIM JUNGHOON
description A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014117528A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014117528A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014117528A13</originalsourceid><addsrcrecordid>eNrjZBAJdvX1dPb3cwl1DvEPUvD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhiaGhuamRhaOhsbEqQIABOcfsg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEMICONDUCTOR MODULE</title><source>esp@cenet</source><creator>BYUN JAEBUM ; OH JOONYOUNG ; JEONG JAE-WOO ; CHOI JINYOUNG ; KANG HEEYOUB ; LEE WON-HWA ; KWAK DONGOK ; KIM JUNGHOON</creator><creatorcontrib>BYUN JAEBUM ; OH JOONYOUNG ; JEONG JAE-WOO ; CHOI JINYOUNG ; KANG HEEYOUB ; LEE WON-HWA ; KWAK DONGOK ; KIM JUNGHOON</creatorcontrib><description>A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140501&amp;DB=EPODOC&amp;CC=US&amp;NR=2014117528A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140501&amp;DB=EPODOC&amp;CC=US&amp;NR=2014117528A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BYUN JAEBUM</creatorcontrib><creatorcontrib>OH JOONYOUNG</creatorcontrib><creatorcontrib>JEONG JAE-WOO</creatorcontrib><creatorcontrib>CHOI JINYOUNG</creatorcontrib><creatorcontrib>KANG HEEYOUB</creatorcontrib><creatorcontrib>LEE WON-HWA</creatorcontrib><creatorcontrib>KWAK DONGOK</creatorcontrib><creatorcontrib>KIM JUNGHOON</creatorcontrib><title>SEMICONDUCTOR MODULE</title><description>A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUvD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhiaGhuamRhaOhsbEqQIABOcfsg</recordid><startdate>20140501</startdate><enddate>20140501</enddate><creator>BYUN JAEBUM</creator><creator>OH JOONYOUNG</creator><creator>JEONG JAE-WOO</creator><creator>CHOI JINYOUNG</creator><creator>KANG HEEYOUB</creator><creator>LEE WON-HWA</creator><creator>KWAK DONGOK</creator><creator>KIM JUNGHOON</creator><scope>EVB</scope></search><sort><creationdate>20140501</creationdate><title>SEMICONDUCTOR MODULE</title><author>BYUN JAEBUM ; OH JOONYOUNG ; JEONG JAE-WOO ; CHOI JINYOUNG ; KANG HEEYOUB ; LEE WON-HWA ; KWAK DONGOK ; KIM JUNGHOON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014117528A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BYUN JAEBUM</creatorcontrib><creatorcontrib>OH JOONYOUNG</creatorcontrib><creatorcontrib>JEONG JAE-WOO</creatorcontrib><creatorcontrib>CHOI JINYOUNG</creatorcontrib><creatorcontrib>KANG HEEYOUB</creatorcontrib><creatorcontrib>LEE WON-HWA</creatorcontrib><creatorcontrib>KWAK DONGOK</creatorcontrib><creatorcontrib>KIM JUNGHOON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BYUN JAEBUM</au><au>OH JOONYOUNG</au><au>JEONG JAE-WOO</au><au>CHOI JINYOUNG</au><au>KANG HEEYOUB</au><au>LEE WON-HWA</au><au>KWAK DONGOK</au><au>KIM JUNGHOON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR MODULE</title><date>2014-05-01</date><risdate>2014</risdate><abstract>A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR MODULE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T02%3A57%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BYUN%20JAEBUM&rft.date=2014-05-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014117528A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true