SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the o...

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Bibliographische Detailangaben
Hauptverfasser: BYUN JAEBUM, OH JOONYOUNG, JEONG JAE-WOO, CHOI JINYOUNG, KANG HEEYOUB, LEE WON-HWA, KWAK DONGOK, KIM JUNGHOON
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.