SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

When a substrate W is processed, a cover member covers a peripheral portion of the upper surface of the substrate held by the substrate holding unit, and a central portion of the substrate located at an inner position than the peripheral portion in a radial direction is exposed without being covered...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ITO YUKI, OKAMOTO EIICHIRO, HIGASHIJIMA JIRO, AMANO YOSHIFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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