SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

When a substrate W is processed, a cover member covers a peripheral portion of the upper surface of the substrate held by the substrate holding unit, and a central portion of the substrate located at an inner position than the peripheral portion in a radial direction is exposed without being covered...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ITO YUKI, OKAMOTO EIICHIRO, HIGASHIJIMA JIRO, AMANO YOSHIFUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:When a substrate W is processed, a cover member covers a peripheral portion of the upper surface of the substrate held by the substrate holding unit, and a central portion of the substrate located at an inner position than the peripheral portion in a radial direction is exposed without being covered by the cover member. A gap is formed between the lower surface of the cover member and the peripheral portion of the upper surface of the substrate held by the substrate holding unit. When the interior space of the cup is exhausted, a gas present above the interior space of the cup is introduced from a space enclosed by the internal peripheral surface of the cover member through the gap into the interior space of the cup.