HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE

A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion...

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Hauptverfasser: YAMAMOTO TOSHIHISA, KOBAYASHI YUUJI, YAMANAKA TAKAHIRO, HARA YOSHIMICHI, KAMEYAMA KOUJI
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creator YAMAMOTO TOSHIHISA
KOBAYASHI YUUJI
YAMANAKA TAKAHIRO
HARA YOSHIMICHI
KAMEYAMA KOUJI
description A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2014111944A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2014111944A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2014111944A13</originalsourceid><addsrcrecordid>eNqNy7EKwjAQgOEsDqK-w4GzYDSL47W5mECTSHIZOpUicRIt1PdHBMHV6V--fyl6S8igXc7uguxigMyptFwSgYkJfOnYddhTgiZi0oBBgye2UUM04DEUgx_uwhnY0m9fi8VtvM918-1KbA1xa3d1eg51nsZrfdTXUPJhL5WU8qQUyuN_6g0a3DLK</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE</title><source>esp@cenet</source><creator>YAMAMOTO TOSHIHISA ; KOBAYASHI YUUJI ; YAMANAKA TAKAHIRO ; HARA YOSHIMICHI ; KAMEYAMA KOUJI</creator><creatorcontrib>YAMAMOTO TOSHIHISA ; KOBAYASHI YUUJI ; YAMANAKA TAKAHIRO ; HARA YOSHIMICHI ; KAMEYAMA KOUJI</creatorcontrib><description>A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140424&amp;DB=EPODOC&amp;CC=US&amp;NR=2014111944A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140424&amp;DB=EPODOC&amp;CC=US&amp;NR=2014111944A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAMOTO TOSHIHISA</creatorcontrib><creatorcontrib>KOBAYASHI YUUJI</creatorcontrib><creatorcontrib>YAMANAKA TAKAHIRO</creatorcontrib><creatorcontrib>HARA YOSHIMICHI</creatorcontrib><creatorcontrib>KAMEYAMA KOUJI</creatorcontrib><title>HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE</title><description>A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy7EKwjAQgOEsDqK-w4GzYDSL47W5mECTSHIZOpUicRIt1PdHBMHV6V--fyl6S8igXc7uguxigMyptFwSgYkJfOnYddhTgiZi0oBBgye2UUM04DEUgx_uwhnY0m9fi8VtvM918-1KbA1xa3d1eg51nsZrfdTXUPJhL5WU8qQUyuN_6g0a3DLK</recordid><startdate>20140424</startdate><enddate>20140424</enddate><creator>YAMAMOTO TOSHIHISA</creator><creator>KOBAYASHI YUUJI</creator><creator>YAMANAKA TAKAHIRO</creator><creator>HARA YOSHIMICHI</creator><creator>KAMEYAMA KOUJI</creator><scope>EVB</scope></search><sort><creationdate>20140424</creationdate><title>HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE</title><author>YAMAMOTO TOSHIHISA ; KOBAYASHI YUUJI ; YAMANAKA TAKAHIRO ; HARA YOSHIMICHI ; KAMEYAMA KOUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2014111944A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAMOTO TOSHIHISA</creatorcontrib><creatorcontrib>KOBAYASHI YUUJI</creatorcontrib><creatorcontrib>YAMANAKA TAKAHIRO</creatorcontrib><creatorcontrib>HARA YOSHIMICHI</creatorcontrib><creatorcontrib>KAMEYAMA KOUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAMOTO TOSHIHISA</au><au>KOBAYASHI YUUJI</au><au>YAMANAKA TAKAHIRO</au><au>HARA YOSHIMICHI</au><au>KAMEYAMA KOUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE</title><date>2014-04-24</date><risdate>2014</risdate><abstract>A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator.</abstract><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-18T00%3A03%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YAMAMOTO%20TOSHIHISA&rft.date=2014-04-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2014111944A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true