HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE
A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion...
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creator | YAMAMOTO TOSHIHISA KOBAYASHI YUUJI YAMANAKA TAKAHIRO HARA YOSHIMICHI KAMEYAMA KOUJI |
description | A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator. |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | HEAT DISSIPATION STRUCTURE FOR MULTILAYER BOARD AND METHOD OF MANUFACTURING THE STRUCTURE |
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