ENCAPSULATING PACKAGE FOR AN INTEGRATED CIRCUIT

An apparatus is provided. An integrated circuit or IC is secured to a package housing. The IC has an IC substrate and an epitaxial layer formed over the substrate and having an active region and an upper surface. The upper surface is substantially exposed, and bond pads are formed over the epitaxial layer. Bond fixtures are each secured to and in electrical contact with at least one of the bond pads and with the package housing. A fill formed over at least a portion of the epitaxial layer so as to substantially encapsulate the active region, where the fill has a dielectric constant that is substantially equivalent to the dielectric constant of air. Additionally, the fill has a thickness, where the thickness is sufficiently large enough to confine parasitics of the active region at the upper surface of the epitaxial layer.