METHODS, SYSTEMS, COMPONENTS, AND COMPOSITIONS FOR SIMULTANEOUSLY TREATING A SUBSTRATE AND ADHERING OR APPLYING A BONDING AGENT THERETO

Some select variations may include methods, devices and systems for simultaneously treating a substrate and adhering or applying a bonding agent thereto.

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Bibliographische Detailangaben
Hauptverfasser: EZZAT HESHAM A, ULICNY JOHN C
Format: Patent
Sprache:eng
Schlagworte:
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Zusammenfassung:Some select variations may include methods, devices and systems for simultaneously treating a substrate and adhering or applying a bonding agent thereto.