PHOTOSENSITIVE RESIN COMPOSITION

There is provided provide a photosensitive resin composition which can markedly improve transparency, heat resistance, heat discoloration resistance, solvent resistance, and patterning properties. A photosensitive resin composition including: a polymer (A) in which a content of a unit structure cont...

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Bibliographische Detailangaben
1. Verfasser:	YUKAWA SHOJIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	There is provided provide a photosensitive resin composition which can markedly improve transparency, heat resistance, heat discoloration resistance, solvent resistance, and patterning properties. A photosensitive resin composition including: a polymer (A) in which a content of a unit structure containing a boronic acid group, a unit structure containing a boronic acid ester group, or a combination of these unit structures is 20 mol % to 100 mol % of a total molar number of unit structures constituting the polymer; and a photosensitizer (B). The polymer (A) preferably has a weight average molecular weight of 1,000 to 50,000. A cured film obtained from the photosensitive resin composition. A microlens prepared from the photosensitive resin composition.