STACKED DIE POWER CONVERTER

A stacked die power converter package includes a lead frame including a die pad and a plurality of package pins, a first die including a first power transistor switch (first power transistor) attached to the die pad, and a first metal clip attached to one side of the first die. The first metal clip...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ROMIG MATTHEW D, CARPENTER BRIAN A, HARRISON WILLIAM T, SANZO CHRISTOPHER, LOHIA ALOK
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A stacked die power converter package includes a lead frame including a die pad and a plurality of package pins, a first die including a first power transistor switch (first power transistor) attached to the die pad, and a first metal clip attached to one side of the first die. The first metal clip is coupled to at least one package pin. A second die including a second power transistor switch (second power transistor) is attached to another side on the first metal clip. A controller is provided by a controller die attached to a non-conductive layer on the second metal clip on one side of the second die.