PATTERN FORMING METHOD

PATTERN FORMING METHOD

According to one embodiment, a pattern forming method includes forming a physical guide, in which at least an upper part of a side wall surface of a concave section is an inclined surface, on a film to be processed, forming a polymer layer containing at least two kinds of segments inside the concave...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: YONEMITSU HIROKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:According to one embodiment, a pattern forming method includes forming a physical guide, in which at least an upper part of a side wall surface of a concave section is an inclined surface, on a film to be processed, forming a polymer layer containing at least two kinds of segments inside the concave section of the physical guide, microphase-separating the polymer layer, to form self-assembled polymer domains including a first polymer section and a second polymer section, and processing the film to be processed by use of the self-assembled polymer domains.