CIRCUIT BOARD WITH REDUCED ADHESIVE OVERFLOW AND CIRCUIT STRUCTURE THEREOF

A circuit board with reduced adhesive overflow includes a substrate and a conductive layer. The conductive layer is disposed on the substrate. The conductive layer includes a hole, a first placement area and a second placement area. The hole is used for forming a cavity with the substrate. The first placement area is used for the first electronic element to be fixedly connected onto the circuit board through the first contact surface. The second placement area is used for the second electronic element to be fixedly connected onto the circuit board through the second contact surface. An adjacent place of the first placement area and the second placement area and the hole are overlapped. The cavity is used to accommodate the conductive adhesive for fixedly connecting the first electronic element and the second electronic element.