PRODUCTION OF ADHESION STRUCTURES IN DIELECTRIC LAYERS USING PHOTOPROCESS TECHNOLOGY AND DEVICES INCORPORATING ADHESION STRUCTURES

PRODUCTION OF ADHESION STRUCTURES IN DIELECTRIC LAYERS USING PHOTOPROCESS TECHNOLOGY AND DEVICES INCORPORATING ADHESION STRUCTURES

In various aspects of the disclosure, a semiconductor device including at least one semiconductor die; a dielectric layer adjoining the semiconductor die; geometric structures formed in the dielectric layer; and a conductive layer deposited over the dielectric layer, wherein the conductive layer is...

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Bibliographische Detailangaben
Hauptverfasser: HEDENIG URSULA, SCHOENHERR HELMUT, MUTH RALPH, PLAGMANN JOERN, GRILLE THOMAS
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In various aspects of the disclosure, a semiconductor device including at least one semiconductor die; a dielectric layer adjoining the semiconductor die; geometric structures formed in the dielectric layer; and a conductive layer deposited over the dielectric layer, wherein the conductive layer is at least partially located over the geometric structures.