SUBSTRATE FOR MOUNTING ELEMENT AND OPTICAL MODULE

An opening is provided corresponding to an installation area of a semiconductor element in an insulating resin layer for a base material. A first insulating resin layer is provided on a part of one main surface of the insulating resin layer outside the opening to surround the opening. In addition, a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DEGUCHI KOUTARO, NAKASATO MAYUMI, NAGAMATSU MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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