SUBSTRATE FOR MOUNTING ELEMENT AND OPTICAL MODULE

An opening is provided corresponding to an installation area of a semiconductor element in an insulating resin layer for a base material. A first insulating resin layer is provided on a part of one main surface of the insulating resin layer outside the opening to surround the opening. In addition, a...

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Bibliographische Detailangaben
Hauptverfasser:	DEGUCHI KOUTARO, NAKASATO MAYUMI, NAGAMATSU MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An opening is provided corresponding to an installation area of a semiconductor element in an insulating resin layer for a base material. A first insulating resin layer is provided on a part of one main surface of the insulating resin layer outside the opening to surround the opening. In addition, a second insulating resin layer coats in a continuous manner: the edge portion of the opening on the one main surface of the insulating resin layer; the end face of the opening passing through the insulating resin layer; and the edge portion of the opening on the other main surface of the insulating resin layer. The upper end portion of the end face of the second insulating resin layer in contact with the one main surface of the insulating resin layer protrudes toward the first insulating resin layer.