HARDENER FOR EPOXY RESIN SYSTEMS AND USE THEREOF

A hardener system for epoxy resins comprising i) at least one aromatic dianhydride compound A having a melting point of at least 35° C., ii) at least one monoanhydride compound B having a melting point of not more than 30° C. and iii) at least one catalyst C, is provided. The aromatic dianhydride co...

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Bibliographische Detailangaben
Hauptverfasser:	RINKER STEFANIE, VON ITTER FRANZ-ALBERT, NEUMANN MANFRED, WILLY BENJAMIN, BRESSEL BETTINA, JONES CHRIS, DIMMIT JEFFREY H
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A hardener system for epoxy resins comprising i) at least one aromatic dianhydride compound A having a melting point of at least 35° C., ii) at least one monoanhydride compound B having a melting point of not more than 30° C. and iii) at least one catalyst C, is provided. The aromatic dianhydride compound A is dispersed in the hardener system. The present invention further provides for the use of said hardener systems and to processes for hardening epoxy resin systems.