MODULAR INVERTER ARRANGEMENT

An arrangement for a modular inverter includes a number of power semiconductors and cooling elements, where the cooling elements are connected to the power semiconductors for cooling the power semiconductors. The power semiconductors and the cooling elements are disposed around a center axis of the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SEVAEKIVI PERTTI, HEIKKILAE TEEMU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An arrangement for a modular inverter includes a number of power semiconductors and cooling elements, where the cooling elements are connected to the power semiconductors for cooling the power semiconductors. The power semiconductors and the cooling elements are disposed around a center axis of the arrangement in such a manner that they demark a channel around the center axis in which a cooling medium is able to flow in the direction of the center axis. The arrangement includes a first tube-shaped ring film capacitor around the center axis of the arrangement. The power semiconductors are arranged between the cooling elements and an inner surface of the first tube-shaped ring film capacitor.