WSP DIE HAVING REDISTRIBUTION LAYER CAPTURE PAD WITH AT LEAST ONE VOID

WSP DIE HAVING REDISTRIBUTION LAYER CAPTURE PAD WITH AT LEAST ONE VOID

A MP die with a redistribution layer ("RDL") capture pad having at least one void therein and having an RDL capture pad outer peripheral edge and an under bump metal ("UBM") pad positioned above the RDL capture pad and having a UBM pad outer peripheral edge positioned laterally i...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: DANIELS JEFFREY DAVID, MORRISON GARY PAUL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A MP die with a redistribution layer ("RDL") capture pad having at least one void therein and having an RDL capture pad outer peripheral edge and an under bump metal ("UBM") pad positioned above the RDL capture pad and having a UBM pad outer peripheral edge positioned laterally inwardly of the RDL capture pad outer peripheral edge and positioned laterally outwardly of all the voids in the RDL capture pad.