DUAL MEMORY CARD SOCKET
The Present Disclosure relates to mold a micro SIM card connecting terminal and a micro SD card connecting terminal by means of an integrated terminal mold, so as to significantly reduce the whole length of the dual memory card socket and manufacturing method thereof. The Present Disclosure is forme...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The Present Disclosure relates to mold a micro SIM card connecting terminal and a micro SD card connecting terminal by means of an integrated terminal mold, so as to significantly reduce the whole length of the dual memory card socket and manufacturing method thereof. The Present Disclosure is formed by a structure manufactured by molding the micro SIM card connecting terminal and the micro SD card connecting terminal by means of an integrated terminal mold, and then separating them by a cutting process. |
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