METHODS FOR FABRICATING DUAL DAMASCENE INTERCONNECT STRUCTURES

Methods for fabricating dual damascene interconnect structures are provided herein. In some embodiments, a method for fabricating a dual damascene interconnect structure may include etching a via into a substrate through a first photoresist layer; patterning a second photoresist layer atop the subst...

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Bibliographische Detailangaben

Hauptverfasser:	YALAMANCHILI MADHAVA RAO, SIRAJUDDIN KHALID M, EATON BRAD, VIJAYEN JAYAGATAN R, MISHRA ROHIT
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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