METHOD FOR MANUFACTURING INTEGRALLY FORMED MULTI-LAYER LIGHT-EMITTING DEVICE

A method for manufacturing an integrally formed multi-layer light-emitting device is provided, in which a seat is integrally formed in such a manner that the light-emitting elements can be directly disposed in the chamber. The lens mask is used to seal the light-emitting elements in the chamber of t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LIU KUIIANG, HWU JON-FWU, WU YUNG-FU
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS WEAPONS
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Beschreibung
Zusammenfassung:	A method for manufacturing an integrally formed multi-layer light-emitting device is provided, in which a seat is integrally formed in such a manner that the light-emitting elements can be directly disposed in the chamber. The lens mask is used to seal the light-emitting elements in the chamber of the seat so that some packaging steps can be omitted, and the manufacturing process is simplified. The seat is made of metal having good thermal conductivity instead of plastic materials. The consumption of the package material is reduced, and the heat-dissipation efficiency is increased in the present invention.