METHOD FOR STABILIZING EMBEDDED SILICON

A method for disclosing an integrated circuit embedded in a resin is disclosed. In one embodiment, stabilizing vias can be formed within the resin and can couple to corresponding pads in the integrated circuit. The stabilizing vias can be used in areas prone to failure when the combined resin/integr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	ARNOLD SHAWN X
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method for disclosing an integrated circuit embedded in a resin is disclosed. In one embodiment, stabilizing vias can be formed within the resin and can couple to corresponding pads in the integrated circuit. The stabilizing vias can be used in areas prone to failure when the combined resin/integrated circuit is stressed or undergoes some amount of displacement. In one embodiment, the stabilizing vias can be non-functional vias that do not carry electrical signals or power to or from the integrated circuit.