METHOD FOR FORMING SEMICONDUCTOR DEVICE

A method for forming a semiconductor device includes firstly providing a gate structure disposed on a substrate and a first nitride material layer disposed on the gate structure, secondly performing a protective step to modify the first nitride material layer in the presence of oxygen, then forming...

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Bibliographische Detailangaben
Hauptverfasser: WANG IANG, HUNG CHING-WEN, HUANG CHIH-SEN, CHOU LINGUN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method for forming a semiconductor device includes firstly providing a gate structure disposed on a substrate and a first nitride material layer disposed on the gate structure, secondly performing a protective step to modify the first nitride material layer in the presence of oxygen, then forming a second nitride material layer on the substrate, and later performing a removal step to remove the second nitride material layer without substantially slashing the modified first nitride material layer.