CIRCUIT PATTERN INSPECTING DEVICE AND INSPECTING METHOD THEREOF

CIRCUIT PATTERN INSPECTING DEVICE AND INSPECTING METHOD THEREOF

Provided are a high speed circuit pattern inspecting method and inspecting device which have a short preparation time for inspection and are capable of determining a defect by detecting only an image of one die. A coordinate which is expected to obtain the same pattern as a corresponding coordinate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HIROI TAKASHI, NOJIRI MASAAKI, NINOMIYA TAKU, YAMAMOTO TAKUMA
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
PHYSICS
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Beschreibung
Zusammenfassung:Provided are a high speed circuit pattern inspecting method and inspecting device which have a short preparation time for inspection and are capable of determining a defect by detecting only an image of one die. A coordinate which is expected to obtain the same pattern as a corresponding coordinate and an alignment coordinate are selected by referring to design information. The detected image and the design information are aligned using the alignment coordinate to correct the deviated amount and a pattern of the corresponding coordinate is compared with a pattern of the coordinate which is expected to obtain the same pattern to compare the patterns by detecting only an image of one die.