ON-CHIP CAPACITORS AND METHODS OF ASSEMBLING SAME

An on-chip capacitor a semiconductive substrate is fabricated in a passivation layer that is above the back-end metallization. At least three electrodes are configured in the on-chip capacitor and power and ground vias couple at least two of the at least three electrodes. The first via has a first-c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHILDS MICHAEL A, FISCHER KEVIN J, NATARAJAN SANJAY S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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