HEAT DISSIPATING MODULE CAPABLE OF ENHANCING HEAT DISSIPATING EFFICIENCY

A heat dissipating module includes a heat dissipating member and an air flow guiding mechanism. The air flow guiding mechanism includes a base, an air guiding plate and a stopping structure. The base is disposed on a side of the heat dissipating member, and the air guiding plate is pivoted to the ba...

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Bibliographische Detailangaben
1. Verfasser:	CHO SHIH-HUAI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	A heat dissipating module includes a heat dissipating member and an air flow guiding mechanism. The air flow guiding mechanism includes a base, an air guiding plate and a stopping structure. The base is disposed on a side of the heat dissipating member, and the air guiding plate is pivoted to the base. The stopping structure is disposed on the base. A side of the stopping structure abuts against the air guiding plate, so as to allow the air guiding plate to rotate in a first direction and to stop the air guiding plate from rotating in a second direction opposite to the first direction.