COVER TAPE FOR ELECTRONIC COMPONENT PACKAGING

According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is pro...

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Bibliographische Detailangaben
Hauptverfasser:	HIRAMATSU MASAYUKI, MASUI KEN
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NATURALLY-OCCURRING ELECTRICITY NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PACKAGES PACKAGING ELEMENTS PACKING PAINTS PERFORMING OPERATIONS POLISHES STATIC ELECTRICITY STORING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is provided with a heat sealant layer on top of the base layer, and the aforementioned heat sealant layer contains polyolefin resin and polyether-polyolefin copolymer. The weight ratio of the polyether-polyolefin copolymer in the aforementioned heat sealant layer is 10 weight % or more and 70 weight % or less.