CONDUCTIVE FILM STRUCTURE AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR ICS

A method for forming a conductive film structure is provided, which includes: providing an insulating substrate having a surface; forming a plurality of trenches in the surface of the insulating substrate, wherein the trenches are extended substantially parallel to each other; disposing the insulati...

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Bibliographische Detailangaben
Hauptverfasser: TSAI JEN-HUI, KAO TUNE-HUNE, CHOU MINIEH
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method for forming a conductive film structure is provided, which includes: providing an insulating substrate having a surface; forming a plurality of trenches in the surface of the insulating substrate, wherein the trenches are extended substantially parallel to each other; disposing the insulating substrate into a plating solution and plating conducting layers within the trenches to form a plurality of micro-wires; and stacking a plurality of the insulating substrates or winding or folding the insulating substrate along an axis substantially parallel to an extended direction of the micro-wires to form a conducting lump.