LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

An LED package includes a substrate, an LED chip mounted on the substrate. The LED chip has a side surface and an upper surface. A fluorescent layer is evenly distributed over the LED chip. An encapsulant covers the LED chip and the fluorescent layer. A method of manufacturing the LED package is als...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHEN PINUAN, LIN HSINIANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An LED package includes a substrate, an LED chip mounted on the substrate. The LED chip has a side surface and an upper surface. A fluorescent layer is evenly distributed over the LED chip. An encapsulant covers the LED chip and the fluorescent layer. A method of manufacturing the LED package is also provided.