FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES AND METHODS THEREOF

A flexible film carrier and methods of manufacture, and more particularly, methods and structures to increase interconnect density of modules onto circuit boards is discloses. The structure includes a substrate comprising a plurality of holes and a plurality of contacts having a pitch corresponding...

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1. Verfasser: FASANO BENJAMIN V
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A flexible film carrier and methods of manufacture, and more particularly, methods and structures to increase interconnect density of modules onto circuit boards is discloses. The structure includes a substrate comprising a plurality of holes and a plurality of contacts having a pitch corresponding to a pitch of I/O connections of a laminate. The structure further includes at least one type of connection provided on the substrate and which is positioned so as to avoid interference with a connection of the laminate to a circuit board. The structure further includes wiring electrically connecting the plurality of contacts to the at least one type of connection.