WATERPROOFING BACKING ADHESIVE STRUCTURE

A waterproofing backing adhesive structure is disclosed. The waterproofing backing adhesive structure is applied to an electronic device having a front cover and a display panel. The waterproofing backing adhesive structure includes an adhesive main body, an adhesive material, and a plurality of air...

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Bibliographische Detailangaben
Hauptverfasser:	YEH CHIH-FENG, HUANG HOUUN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A waterproofing backing adhesive structure is disclosed. The waterproofing backing adhesive structure is applied to an electronic device having a front cover and a display panel. The waterproofing backing adhesive structure includes an adhesive main body, an adhesive material, and a plurality of air chambers. The plurality of air chambers are formed on at least one of the surfaces of an upper surface or a bottom surface of the adhesive main body which is attached with the adhesive material for accommodating the air of a bubble generated when the adhesive main body is attached to the front cover or the display panel. The plurality of air chambers are for releasing the pressure of the bubble.