STRUCTURE AND MANUFACTURING METHOD FOR REDUCING STRESS OF CHIP
The invention provides a structure and a manufacturing method thereof for reducing a stress of a chip. The structure comprises a through-silicon via (TSV), a plurality of reinforcing base and a plurality of base bodies. The reinforcing bases are disposed near and around the TSV. The base bodies are...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The invention provides a structure and a manufacturing method thereof for reducing a stress of a chip. The structure comprises a through-silicon via (TSV), a plurality of reinforcing base and a plurality of base bodies. The reinforcing bases are disposed near and around the TSV. The base bodies are disposed near and around the TSV, and the base is disposed on a side of the reinforcing base. The reinforcing base or the base body does not connected with the TSV. |
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