PCB HAVING INDIVIDUAL REFLECTIVE STRUCTURE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE USING THE SAME

A printed circuit board (PCB) having an individual reflective structure and a method for manufacturing a light emitting diode (LED) package using the same, which can prevent reabsorption of light between LED chips by providing an individual reflective structure between the LED chips when the LED package is configured using two or more LED chips. The PCB includes a PCB; a wiring pattern-forming material layer formed on the PCB with an insulating layer interposed therebetween; dams formed on the wiring pattern-forming layer around chip mounting areas of the PCB; and a light reabsorption prevention dam formed on the wiring pattern-forming material layer between the chip mounting areas where LED chips are mounted.