METHODS OF FABRICATING SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING GATE INSULATING LAYERS

A method of fabricating a semiconductor device may include forming active and field regions in a substrate; forming a gate trench in which the active and field regions are exposed; forming a gate insulating layer on a surface of the exposed active region, wherein forming the gate insulating layer in...

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Bibliographische Detailangaben
Hauptverfasser: PARK TAI-SU, LEE GUN-JOONG, HAN SANGUL, YOON JOO-BYOUNG, LEE YOUNG-DONG
Format: Patent
Sprache:eng
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Zusammenfassung:A method of fabricating a semiconductor device may include forming active and field regions in a substrate; forming a gate trench in which the active and field regions are exposed; forming a gate insulating layer on a surface of the exposed active region, wherein forming the gate insulating layer includes forming a first gate oxide layer by primarily oxidizing the surface of the active region, and forming a second gate oxide layer between the surface of the active region and the first gate oxide layer by secondarily oxidizing the surface of the active region; conformally forming a gate barrier layer on the gate insulating layer and the exposed field region; forming a gate electrode layer on the gate barrier layer; and forming a gate capping layer in contact with the gate insulating layer, the gate barrier layer, and the gate electrode layer in the gate trench.