HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Disclosed herein are a heat dissipating substrate and a method of manufacturing the same. The heat dissipating substrate includes: a substrate that is formed of a metal material, wherein at least one via hole is formed in the substrate; an insulating layer formed on a surface of the substrate; a coa...

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Bibliographische Detailangaben
Hauptverfasser:	SEO KI HO, BAE JUN SIK, HEO CHEOL HO, SON SANG HYUK, SHIN SANG HYUN
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING WEAPONS
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Beschreibung
Zusammenfassung:	Disclosed herein are a heat dissipating substrate and a method of manufacturing the same. The heat dissipating substrate includes: a substrate that is formed of a metal material, wherein at least one via hole is formed in the substrate; an insulating layer formed on a surface of the substrate; a coating layer that is formed on an inner wall surface of the via hole and is formed of a conductive or non-conductive material; a plurality of metal patterns that are formed on the insulating layer and are electrically separated from one another; a metal layer that is extended from the metal patterns to be formed on the coating layer formed on the inner wall surface of the via hole; and a filling material that is formed of a non-conductive material and is filled between the metal layers in the via hole.