SUBSTRATE INSPECTION JIG AND SUBSTRATE INSPECTION METHOD

A substrate inspection jig for use in inspection of an electrical property of a printed board to be inspected on which an electronic component is mounted includes a spacer which is mounted on the printed board to be inspected, a conductive plate which is connected to the spacer, and is disposed alon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MIURA YUJI, NAGAI SHINJI, SHIKI TOMOHIKO, TANABE KATSUHIRO, SADAKANE YASUKAZU, KAWAKAMI TOMOKO, MIYANISHI KEISHI, WATANABE HIDEO, SHIBASAKI TADAYOSHI, INAKAZU HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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Beschreibung
Zusammenfassung:	A substrate inspection jig for use in inspection of an electrical property of a printed board to be inspected on which an electronic component is mounted includes a spacer which is mounted on the printed board to be inspected, a conductive plate which is connected to the spacer, and is disposed along an arrangement direction of electrode terminals of the electronic component to be inspected, and a fastener which fastens the spacer on the printed board to be inspected, wherein the plate is disposed above the printed board to be inspected so as to avoid contact with the printed board to be inspected, and a predetermined potential of the printed board to be inspected is set to the plate through the spacer or/and the fastener.